Acursens Ceramic Piezoresisitive Pressure Sensor Transducer Series

• Type: Refrigerant
• Component: SemiConductor Type
• For: Ceramic Pressure Transmitter
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Pressure Sensor
• Output Signal Type: Analog Type
• Production Process: Ceramics
• Material: Ceramics
• Thread Type: PT
• Wiring Type: Three-Wire
• Measuring Medium: Liquid
• IP Rating: IP65
• Certification: ISO
• Customized: Customized
• Pressure Range: 0~2~400 Bar
• Accuracy: 0.2/0.5 Grades
• Supply Voltage: 12V ~ 28V DC
• Transport Package: Standard
• Specification: HEX27*52mm
• Trademark: ACURSENS
• Origin: China
• HS Code: 9026900090
• Production Capacity: 1000000/Month
• Package Size: 10.00cm * 10.00cm * 5.00cm
• Package Gross Weight: 0.100kg

Product Description

Product Description

ACURSENS pressure sensor transducer series 
Technical Parameter:

Item	Parameter
Working Pressure Range	0~0.2~40Mpa
Supply Voltage	12V ~ 28V DC
Output Voltage	0.5~4.5 V
Total Accuracy	± 0.5% FS
Temperature Compensation	0 °C~70 °C
Proof Pressure	2x pressure range
Burst Pressure	3x pressure range
Load Resistance	≥10kΩ
Power Supply Current	≤10mA
Insulation Resistance	≥100MΩ (DC500V)
Media	Dry air or Non-corrosive gas
Protection Rate	IP65

Features:

 

 

 

Application:

Company Profile

Guangdong Ascenta Technology Co., Ltd is a high-technique enterprise specialized in the essential sensor elements, integrated with R&D, Production and Marketing. Our main products are sensor elements & modular for Pressure, Temperature, Humidity, Pneumatics. We mainly serve the industries of Automotive, Appliances, Medical Treatment, New Energy and IOT, simultaneously supplying one-stop solutions.
Our products are involved High, Medium, Low Tension Sensor cores & chips, including the low tension MEMS pressure wafer chip, ceramic pressure resistor & capacitor sensor chip, thick film metal high tension pressure sensor chip and other innovative pressure measurement core  elements and high precision ASIC chips.
Certified with ISO9001 system & IATF 16949 Automotive Quality Management System Standard (QMS) and International Railway Industry Standard (IRIS), we are promising high quality and stable durability to consumers by offering eligible products.
Ascenta Technology is responsible to raise the national sensor development and break up the foreign monopolization. Adhered to break through the constant limitations of core technique step by step, we keep providing the sensor elements to future Artificial Intellectual world for the well-being of mankind.

 

Our Service

▪ Reaserch & Development:
Our R&D team members are the doctors and masters graduated from the domestic well-known universities, who are the experts
and engineers with 20 years' experience of sensors and revelant software & hardware, consitituing the quite comprehensive strength
team, fitting with the top material and component reliability test laboratory as well as the testing devices. 

▪ One-stop Customized Solution:
√ Core Material Development Ability
√ Advanced MEMS wafer design & manufacturing
√ Leading application specific integrated circuit ASIC
√ Customization upon detail principle, application scene and packaging

▪ Monthly Production Capacity:
- 400.000 pcs ceramic pressure sensor chips
- 2.000.000 pcs temperature & humidity sensor elements
- 30.000 pcs thin film platinum RTDs 
- 1.000.000pcs 4/6 inches MEMS wafer chips
- 10.000pcs pressure sensor transducers

Factory Travel

• Factory Plant & Staffs
• 5-floor building covered with 8000+ sqm plants
• 30+ R&D menbers
• 100+ workers

 

• Laboratory of sensitive material & synthetic material

 

• Showroom - sensor for Pressure · Humidity · Temperature
Applied in the fields of 
• Automotives 
• Appliance
• Agriculture
• Food & Beverage 
• HVAC
• Industrial Control
• Medical Device
• Smart Electronics
• Water Treatment

 

• 100/1000 level clean workshop
5000+ sqm workshop individe into 
▪ thick flim circuit production line 
▪ MEMS production line for 4/6 inch semi-conductor
▪ finished sensor prodution line 

 

• 100+ equipments
the screen printer, precision laser resistance adjustment machine, sintering furnace, mask aligner, magnetron sputter machine, etching machine, bonding machine, molding machine, chip mounting machine and other Front-End & Back-End packaging machine

 

• Quality Check
▪ Rountine check & Spot check to each process
▪ Calibration to each product before delivery

 

• Clean & Package
▪ Apparence Check to pick out the defects
▪ Pack the products as requested

 

Certifications

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